The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The scientific event will take place in Cluj-Napoca, on October 23rd–26th, 2019. Web page: http://www.siitme.ro
SUBMISSION OF ABSTRACTS AND PAPERS
Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, using the SIITME Conference Management System.
Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.
1. Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.
Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2. Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.
A. Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
B. Components, Assembling, and Manufacturing Technology
C. Design of Electronic Circuits and Systems
D. Electronics Simulation & Modelling
E. Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics
F. Applied Reliability
G. Challenges in Global Education
General Chair: Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Academic Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair: Marian Petrescu, Continental Automotive, Iasi
Conference Chair: Mihaela Hnatiuc, Constanta Maritime University, Romania
Conference Co-Chair: Cosmin MOISA, Continental Automotive, Timisoara, Romania
Technical Program Chair: Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair: Norocel CODREANU, “Politehnica” University of Bucharest, Romania
Awards Committee Chair: Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany
Scientific Committee Chair: Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
The conference fee includes the opening ceremony and welcome reception, full access to all technical (oral and poster) sessions, exhibition area, all meals (breakfasts, coffee breaks, lunches and dinners), three nights accommodation, printed abstracts proceedings, conference proceedings on memory stick, conference kit (conference bag, badge, booklet, pen, and other related objects), and participation to the cultural programme.
Tel: 0040 213169633 / 0040 214024638
Fax: 0040 213169634
Splaiul Independentei 313
06042, Bucharest, Romania