Who We Are…

APTE, The Association for Promoting Electronics Technology is IMAPS Romania and has currently 88 members. APTE was founded in 2002, by the Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) together with highly respected members of the electronics industry, in order to support the electronics packaging education and engineering, in a climate of trust, ethics, and social responsibility. APTE/ IMAPS Romania organizes annually important technical and scientific events, two of the most important being TIE (tie.ro) and SIITME (siitme.ro), international events with large participation. Go to their webpages for additional details!

A globally-competitive work force

A globally-competitive work force with theoretical, as well as hands-on, education must be trained. In addition to the areas of science, engineering, microelectronics and packaging, this training must encompass the broader areas of business, economics, ethics, foreign culture and languages.

Latest News

  • International Symposium SIITME 2019
    The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). […]
  • TIE – the best-of-Europe IEEE – EPS student event
    Every year the best PCB CAD designer students from the area of the Central European Hu&Ro IEEE-EPS Chapter get together to match their skills against each […]

Events

Advanced SiP 2021

International Conference on System-in-Package (SiP) Technology
9 Aug - 12 Aug 2021
online

EMPC 2021

23rd European Microelectronics and Packaging Conference
13 Sep - 16 Sep 2021
online

POWER 2021

From Nano to Macro Power Electronics and Packaging European Workshop
25 Nov 2021
Tours, France
IMAPS FR Event

MiNaPAD 2022

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum
10 Mar - 11 Mar 2022
Grenoble
IMAPS FR Event

Sponsors