September 12, 2019
The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). […]
September 12, 2019
Every year the best PCB CAD designer students from the area of the Central European Hu&Ro IEEE-EPS Chapter get together to match their skills against each […]
September 12, 2019
The first annual Occam Prize International Design Competition has begun accepting registrations from circuit designers from around the world. Cash prizes totaling $5,000 will be awarded […]
September 12, 2019
PCB Design 007, an international recognized USA publication published the following article about TIE 2017 event. The entire article can be read at: http://www.iconnect007.com/index.php/article/104820 During the […]