The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

The conference consists of the following tracks:

– 3D Integration
– Flip Chip, Wafer Level Packaging & Fan-Out
– Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Generation Applications

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than October 11th, 2019, using the online submittal form at: www.imaps.org/abstracts.htm.