The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

The conference consists of the following tracks:

– 3D Integration
– Flip Chip, Wafer Level Packaging & Fan-Out
– Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Generation Applications

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than October 11th, 2019, using the online submittal form at: www.imaps.org/abstracts.htm.

August 19, 2019

DPC 2020

The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for […]
August 19, 2019

5th IMAPS flash Conference 2019

The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]