Every year in autumn IMAPS Germany organizes its annual conference on current topics of assembly and connection technology in all fields of application. In order to secure, strengthen and further develop Germany as a business location, IMAPS Germany would like the annual conference to be understood as an important platform for the necessary professional discussion between industry and universities as well as production and research. We therefore cordially invite you again this year to take part in the autumn conference at the University of Applied Sciences Munich from October 17th to 18th, 2019 and to present and discuss your results in the field of microelectronic packaging with representatives from industry and science.

The focus of this year’s IMAPS conference is:

Design, modelling and simulation
– Electrical and electromagnetic design
– Thermal and thermomechanical design
– Design suitable for production and testing
– Current focal points: HF design and 3D design

Materials and processes
– Substrate materials and surface coating systems
– Production of wiring carriers
– Connection technologies (Flip Chip, CoB, SMT, embedding etc.)
– Protection, potting and encapsulation processes and materials
– Current focus: nanomaterials

Technologies of system integration
– Wafer-level packaging (CSP, SiP etc.)
– Substrate-level packaging (system on board, embedding etc.)
– MEMS/ sensor packaging
– Optoelectronic packaging
– Current focus: 3D packaging

Quality and reliability
– Process monitoring / test strategies
– Testing systems
– Thermomechanical reliability
– Reliability under combined loads
– Current focus: lifetime monitoring and prediction

Exhibitor Registration
Exhibitors can register here.

Programme and further information
You can download the programme and further information on the autumn conference here. If you are interested in participating in the conference, please register here.