August 19, 2019
Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]
August 19, 2019
Every year in autumn IMAPS Germany organizes its annual conference on current topics of assembly and connection technology in all fields of application. In order to […]
August 19, 2019
The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]
August 19, 2019
The 43rd IMAPS Poland Conference 2019 will take place at the Conference Centre of Wrocław University of Science and Technology from September 4th to 6th, 2019. […]
March 28, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]
March 28, 2019
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 22-23, 2019. MiNaPAD […]
December 13, 2018
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]
December 13, 2018
The MicroTech 2019 Conference & Exhibition, organised by IMAPS-UK, focuses on the rapidly developing UK Microelectronics & Semiconductor Industry and applications for Power management components. Touching […]
November 15, 2018
The 15th Annual Device Packaging Conference (DPC 2019) will be held in Fountain Hills, Arizona, on March 4-7, 2019. The conference is a major forum for […]
November 15, 2018
The 52nd International Symposium on Microelectronics will take place in the Hynes Memorial Center in Boston from September 30th to October 3rd, 2019. The Technical Committee […]
November 15, 2018
The Advanced SiP 2019 is the world‘s largest Advanced System-in-Package (SiP) event. Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology from […]
September 17, 2018
The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. […]