The 54^th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.The program includes keynote presentations, Professional Development Courses, technical presentations and Posters.

The 5 technical tracks will include the following:

1: Manufacturing Optimization

2: Wafer Level/Panel Level (Advanced RDL)

3: High Performance / High Reliability

4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)

5: Advanced Process & Materials (Enabling Tech.)

For further information about the program and keynote speakers click here.