September 16, 2018

Directions in advanced packaging

This is the second in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. […]
September 13, 2018

ESTC 2018 in Dresden

Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System Integration Technology Conference (ESTC) series is the premier venue for academics and industry to present and […]
August 31, 2018

EMPC 2019: Technical Program now online

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […]