September 17, 2018

Power 2018

Following the success of the Power Electronics Workshop organized over the past 9 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France […]
September 16, 2018

ICEP 2019

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
September 16, 2018

IMPACT 2018

MPACT 2018 Conference, organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year, it will […]
September 16, 2018

ISMP 2018

the 17th international Symposium on Microelectronics and Packaging (ISMP 2018) will be held at COEX convention center, Seoul, Korea, on October 24-26, 2018. This international conference […]