November 15, 2018
The 15th Annual Device Packaging Conference (DPC 2019) will be held in Fountain Hills, Arizona, on March 4-7, 2019. The conference is a major forum for […]
November 15, 2018
The 52nd International Symposium on Microelectronics will take place in the Hynes Memorial Center in Boston from September 30th to October 3rd, 2019. The Technical Committee […]
November 15, 2018
The Advanced SiP 2019 is the world‘s largest Advanced System-in-Package (SiP) event. Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology from […]
September 17, 2018
The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. […]