Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]
Every year in autumn IMAPS Germany organizes its annual conference on current topics of assembly and connection technology in all fields of application. In order to […]
The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]
The 43rd IMAPS Poland Conference 2019 will take place at the Conference Centre of Wrocław University of Science and Technology from September 4th to 6th, 2019. […]