IMAPS UK, in partnership with the Torbay Hi-Tech Forum, bring you the 2nd International Conference on Packaging Technology for the Photonics and the Opto components and systems industry.

The conference will meet the needs of those involved with the design of systems, development of components as well as users and will address issues of placement of die and components, Die and component Packaging for emerging

Optoelectronic technology applications. Interconnection technologies will be a key feature of the presentations and the event will offer the opportunity to learn about emerging Photonics and Opto Technology, Process tools and flows, Materials and equipment selection/options as well as the Design – Industrialisation aspects that are now required.

Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition. This conference aims to bring together an array of electronics systems, material, process and packaging experts as well as service providers to present a comprehensive review of the spectrum of Optoelectronics engineering.